The news pertaining to new Apple devices has now churned up something intricate, in terms of the new chips to be incorporated in the new iPhone. As such, the new iPhone is said to step up from the 65 nm BCM4330, by incorporating Broadcom BCM4334 into it. It is also suggested that the much anticipated Broadcom BCM4334 will be built on a smaller, yet efficient 40 nm process, as against the current 65 nm process used by the current BCM4330 chip. In doing so, Broadcom confirms a further reduction of 40 to 50% in power. However, the air interface in BCM4334 remains the same as that in BCM4330. With significant power savings, the new iPhone can now have bigger screen, and a sleek thinner model with a thinner battery.

Having Broadcom BCM4334 in the new iPhone will render a dual advantage, providing ultra-low power consumption, along with a complete wireless connectivity system. Both these attributes rendered by BCM4334 will help in consumption of mass market smartphone devices. Moreover, as the chip includes MAC/baseband/radio, Bluetooth 4.0 + HS, IEEE 802.11 a/b/g/n single-stream MAC/baseband/radio, and an integrated FM radio receiver, it enables simultaneous support network connectivity by also  allowing content streaming via technologies such as Wi-Fi Display and Wi-Fi Direct.

Looks like Apple would be adopting a Wi-Fi Direct/Adhoc on the second Wi-Fi connection, although restricting its usage over its own AirPlay protocol, and that seems very interesting. All its previous Mac models have built-in Wi-Fi Direct on dual-band Wi-Fi cards. However, new iPhone will be the first iOS device that allows the implementation of AirDrop. As such, we could experience the Lion Adhoc file-sharing protocol being added to iOS 6.

Apple certainly has a marketing reason attached to Wi-Fi chip in executing an  more expensive dual-mode version that it announced late February. As Wi-Fi Direct is used in many printers, the iOS AirDrop is surely out to make file sharing between Macs and iOS devices very simple indeed.

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